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ZXFV302
4:1 HIGH SPEED MULTIPLEXER
DEVICE DESCRIPTION
The ZXFV302 is a 4:1 high speed analog switch designed for use as a buffered video multiplexer and other high-speed applications. It features low different gain and phase distortion. The high speed high output current capability provides 75 cable drive for use in high performance video applications. The input channel is selected by means of two logic lines using an internal decoder. An output enable line allows expansion to eight channels using two devices ZXFV302 as shown in the example application figure 1. An alternative device, ZXFV301 provides the same functionality and pin-out as the ZXFV302 but with four separate logic lines controlling the switch channels directly.
FEATURES AND BENEFITS
* 3dB Bandwidth 300MHz * Slew rate 450V/ s * Differential gain 0.01% * Differential phase 0.04 * Output current 40mA * Stable up to 100pF load *
5 Volt supply
* Supply current 17mA * 16 pin SO package
APPLICATIONS
* Video routing and switching * CCTV switching * Video distribution selection * RGB multiplexing
Connection Diagram
* High frequency instrumentation Data acquisition * Data acquisition
IN 1 0V IN 2 0V
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
V+ OUT 0V EN A0 A1 NC NC
IN3
0V IN 4 V-
ZXFV302
Ordering information
Part Number ZXFV302N16TA ZXFV302N16TC Container Reel 7 Reel 13 Increment 500 2500
Fig.1:Typical Application for 8 channel CCTV
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ABSOLUTE MAXIMUM RATINGS
Supply voltage VCC Supply voltage VEE Analog inputs to ground Digital inputs to ground Outputs to ground* Output current, max continous Operating Ambient Temperature Range Operating Junction temperature TJMAX -0.5V to +6V -6V to +0.5V VEE -0.5V to VCC +0.5V -0.5V to VCC +0.5V VEE -0.5V to VCC +0.5V 40mA -40 C to 85 C Storage -65 C to 150 C 150 C**
**The thermal resistance from the semiconductor die to ambient is typically 120 C/W when the SO16 package is mounted on a PCB in free air. The power dissipation of the device when loaded must be designed to keep the device junction temperature below TJMAX. *During power-up and power-down, these voltage ratings require an appropriate sequence of applying and removing signals and power supplies.
ELECTRICAL CHARACTERISTICS
5V power supplies, Tamb = 25 C unless otherwise stated. RL = 150 , CL = 10pF Characteristics apply to channel selected, and EN input HIGH unless otherwise stated Test level: P = 100% production test C = characterised only
CONDITIONS TEST MIN 4.75 -5.25 P P P P P All channels held at 0V Active channels held at 0V P P P P C Disabled (EN low) P P P C 2V pk-pk C C C logic input voltage = 5V logic input voltage = 0V C C 0.8 5 -70 1.5 40 30 3 54 51 300 450 2 40 1 4.5 M dB dB MHz V/ s V V pA A -10 -25 13 9 0.99 TYP 5 -5 17 13 1.000 3 45 +11 -11 3 +30 +5 MAX 5.25 -4.75 21 18 1.01 UNIT V V mA mA V/V V k mV A V mA
PARAMETER Supply Voltage V+ Supply Voltage VPositive supply current Negative supply current Voltage gain DC Input Common mode Voltage Input resistance Output offset Voltage Input bias current Output Voltage swing Output drive current Output resistance Output resistance Positive PSRR Negative PSRR Small signal bandwidth 1 Slew rate, 25% to 75% Logic input HIGH V Hmin Logic input LOW V Lmax Logic input current I INHIGH Logic input current I INLOW
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ZXFV302
ELECTRICAL CHARACTERISTICS
5V power supplies, Tamb = 25 C unless otherwise stated. RL = 150 , CL = 10pF Characteristics apply to channel selected, and EN input HIGH unless otherwise stated Test level:P = 100% production test C = characterised only
PARAMETER t ON t OFF t LOW t HIGH Cross-talk, all hostile 1 Differential Gain Differential Phase Switching transients, magnitude Switching transients, duration All channels held at 0V All channels held at 0V Vout = Vout = Vout = Vout = CONDITIONS 2V, see timing diagram 2V, see timing diagram 2V, see timing diagram 2V, see timing diagram TEST C C C C C C C C C MIN TYP 35 10 50 40 75 0.01 0.04 50 25 MAX UNIT ns ns ns ns dB % deg mV ns
10MHz, 0dBm in
Notes: 1. Bandwidth and cross talk measured using Zetex Evaluation Circuit Board detailed later in this datasheet.
Truth table for selection of input channel
A1 X 0 0 1 1 A0 X 0 1 0 1 EN 0 1 1 1 1 OUT Hi Z IN 1 IN 2 IN 3 IN 4
Fig.2: TIMING DIAGRAM
Notes: The `select' waveform represents a change in the the 2 bit control word A0 and A1. tHIGH is equivalent to tLOW but , applies for a positive going transition of OUT.
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CHARACTERISTICS
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APPLICATIONS INFORMATION
Introduction A typical circuit application is outlined in Figure 1, above, where two devices are combined to provide 8-to-1 multiplexing. A more detailed basic application circuit for 4 dc-coupled channels is given in Figure 3, and an AC coupled circuit for 8 channels is shown in Figure 4. These circuits are suitable for 75 transmission line connections at both the input and the output and are useful for distribution of wide-band signals such as video via cables. The 75 reverse terminating resistor at the output gives the correct matching condition to a terminated video cable. The amplifier load is then 150 . The wide bandwidth of this device necessitates some care in the layout of the printed circuit. Partly for this reason, an Evaluation Circuit board is available and is described in a later paragraph. A continuous ground plane is required under the device and its signal connection paths, to provide the shortest possible ground return paths for signals and power supply filtering. A double-sided or multi-layer PCB construction is required, with plated-through via holes providing closely spaced low-inductance connections from some components to the continuous ground plane (some of these holes are not visible in the figures for the Evaluation Circuit Board - artworks and NC drill output can be provided if required). For the power supply filtering, low inductance surface mount capacitors are normally required. It has been found that very good RF decoupling is provided on each supply using a 1000 pF NPO size 0805 ceramic surface mount capacitor, closest to the device pin, with an adjacent 0.1 F X7R capacitor. Other configurations are possible and it may be found that a single 0.01 F or 0.1 F X7R capacitor, size 0805 or smaller, on each supply gives good results. However this should be supported by larger decoupling capacitors elsewhere on the printed circuit board. Values of 1 to 10 F are recommended, particularly where the voltage regulators are located more than a few inches from the device. These larger capacitors are recommended to be solid tantalum electrolytic or ceramic types. Evaluation Circuit An evaluation circuit is available, constructed on a double-side printed circuit board. The circuit is suitable for both the ZXFV301 and ZXFV302 and either device may be fitted. Figures 5 and 6 show the circuit diagram, and the layout of components and copper. A parts list is provided below. This layout serves as a useful example for many applications, showing the practical implementation of the advice given above in the Introduction.
1 10 SW1 TP1 to TP10
BNC connector sockets allow connection to test instruments via 50 cables. The output circuit includes a resistor matching circuit to present a load of 150 to the device and simultaneously provide 50 output impedance. The attenuation of this matching circuit is 15.45 dB. As the device has unity voltage gain, the overall loss when loaded by 75 is also 15.45 dB. EVALUATION CIRCUIT PARTS LIST:
QTY CCT-REF VALUE DESCRIPTION
Resistors, surface mount 4 4 1 1 1 5 R1,R2,R3,R4 R5,R6,R7,R8 R9 R10 R11 R12 to R16 51R 22k 120R 62R 10R 47k 0805 0805 0805 0805 0805 0805
Capacitors, surface mount 6 2 2 Integrated Circuits 1 U1 Zetex ZXF 301N16 or ZXFV302N16 100nF 1nF 10 F 25V ceramic 0805 X7R 50V ceramic 0805 NPO 16V Tant Elec size C
Miscellaneous 5 BNC Socket, PCB straight flange, e.g. Tyco B35N14H999X99 3-way PCB screw terminal block IMO 20.501/3SB DIL switch, 8 way PCB test terminal, red, W.Hughes 100-107
1
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6 ISSUE 4 - NOVEMBER 2002
Figure 3: BASIC APPLICATION CIRCUIT, 4 CHANNEL DC COUPLED, DUAL SUPPLIES
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Figure 4: CCTV CIRCUIT WITH 8 CAMERA FROM SINGLE SUPPLY
ZXFV302
Figure 5: EVALUATION CIRCUIT & PRINTED BOARD LAYOUT SHOWING TOP COPPER (overall dimensions 4x3 inches)
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ZXFV302
Figure 6: EVALUATION CIRCUIT BOARD BOTTOM COPPER (viewed through from top)
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Notes
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Notes
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PACKAGE OUTLINE
DIM
Millimetres MIN MAX 10.00
Inches MIN 0.386 0.05 BSC 0.02 REF 0.51 4.00 1.75 0.25 8 1.27 6.20 0.013 0.15 0.053 0.004 0 0.016 0.228 0.020 0.157 0.069 0.01 8 0.05 0.244 MAX 0.394
A B C D E F G H I J
9.80 1.27 BSC 0.53 REF 0.33 3.80 1.35 0.10 0 0.40 5.80
Conforms to JEDEC MS-012AC Iss C (SO16N) (c) Zetex plc 2002
Europe Zetex plc Fields New Road Chadderton Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 uk.sales@zetex.com Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY11788 USA Telephone: (631) 360 2222 Fax: (631) 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to
www.zetex.com
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